| Arlon, Materials for Electronics Links: Microwave Materials | Electronic Substrates | Tg | CO |
|---|---|---|
| 55NT Multifunctional Epoxy/Thermount® | 170°C |  |
| 85NT Multifunctional Epoxy/Thermount® | 240°C | |
| GE Electromaterials Links: Product Data | Tg | CO |
|---|---|---|
| GETEK® Epoxy/Polyphenylene Oxide Resin | 175° C - 185°C | |
| Gore Electronics Links: Speedboard Specs | Tg | CO |
|---|---|---|
| Speedboard™ C High Performance Prepreg | 220°C | |
| Park/Nelco Links: Tg>170°C | Tg | CO |
|---|---|---|
| N4000-13 High Speed Multifunctional Epoxy Laminate & Prepreg | 210°C | |
| N4000-13 SI® High Speed Multifunctional Epoxy Laminate & Prepreg | 210°C | |
| N4000-6 High-Tg Multifunctional Epoxy Laminate & Prepreg | 175°C | |
| N5000 BT Epoxy Laminate & Prepreg | 185°C | |
| N5000-30 High-Performance, Chip Packaging BT Epoxy Prepreg | 205°C | |
| N5000-32 High-Performance, Chip Packaging BT Epoxy Laminate | 205°C | |
| N7000-1 Polyimide Laminate & Prepreg | 260°C | |
| N7000-2 HT Toughened Polyimide Laminate | 260°C | |
| N8000 Cyanate Ester Laminate & Prepreg | 250°C | |
| Polyclad Laminates, Inc. Links: Product Information | Greenline Products | Tg | CO |
|---|---|---|
| PCL-FR-370 High Tg FR-4 Laminate & Prepreg | 175°C | |
| (Greenline) | 175°C | |
| Rogers Corporation, Advanced Circuit Materials Links: High Frequency Laminates | Laminate Product Overview | Tg | CO |
|---|---|---|
| RO4003® Ceramic-Filled Woven Fiberglass Reinforced | > 280°C | |
| RO4350® Ceramic-Filled Woven Fiberglass Reinforced | > 280°C | |
| RT/duroid® 5870 Glass Microfiber Reinforced PTFE | > 260°C | |
| RT/duroid® 5880 Glass Microfiber Reinforced PTFE | > 260°C | |