Unicircuit, Inc. has extensive specialized manufacturing solutions for CTE Constrainment and Thermally challenged designs /applications, Extreme / Unique HDI structures, and RF Manifolds.
Our ability to provide application specific products is enabled by the following:
- Licensed fabricator for Stablcor
- Ormet Conductive Materials and Core to Core bonding
- FEP and Fusion bonding
- Embedded Components (i.e. resistors, garnets, circulators, ferrites)
- RF Connector Attachment
- LDI (Laser Direct Imaging)
- YAG Laser Etching
- Laser Sculpting / Profiling
- Active Cavity
- Composite / Hybrid Packages
Unicircuit, Inc. will continue to push the boundaries of organic substrate technology via our constant involvement in Mantech, IRAD, and DARPA projects, coupled with our own internally funded initiatives.
For more information regarding solutions to your most challenging applications please contact: LRiley@unicircuit.com or TGragg@unicircuit.com

Unicircuit, Inc. has established manufacturing guidelines that demonstrate an excellent cost vs. performance curve, repeatability, and proven reliability for DOD products, platforms, and applications.