Featured Case Study
Unicircuit, Inc. has established manufacturing guidelines that demonstrate an excellent cost vs. performance curve, repeatability, and proven reliability for DOD products, platforms, and applications.
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| Analytical Laboratory | |
|---|---|
| Mechanical Test (Instron) | Copper to dielectric adhesion, Tensil / compresion testing |
| Fein-Focus X-ray | Real time x-ray, non-destructive location of deflects |
| FTIR (Fourier Transform IR) |
Identification of Contacmination - e.g. flux res, thin film |
| EDS (Energy Dispersive X-ray) |
Elemental analysis of surfaces (used with SEM) |
| Optical Microscopy/cross-section |
Sample prep/microsection PCB's, Assemblies, defects & photos |
| X-ray Flourescence |
Gold / Tin / Lead thinkcness meansurement (u inch) |
| Ion Chromotography |
Cleanliness of chip attach / assembly processes (e.g. CI ions) |
| Gas Chromotography |
Quantification of mulit-component solvents (e.g. fluxes) |
| Gas Chromotography | Quantification of mulit-component in mixes |
| DSC (Differential Scan Calorimetry) |
Cure studies of epoxy / siliconse and Glass transition (Tg) |
| ICP (Inductivly Coupled Plasma) |
Quantitative analysis of trace metals in liquids (ppb) |
| X-ray Diffractin |
Identify inorganic crystaline materials (e.g. lead salts) |
| IST (Internal Stress Testing) |
High current interconneect reliability verification |